Inline selective soldering system
The worlds leading inline selective soldering system HB meets the highest demands in flexibility and throughput. With almost endless possibilities of configurations the system is ideal to meet any customer's requirement.
The additional modules of the HB make it fit for future demands. The HB NXP-450-N is the 3th generation of the leading inline selective soldering system and inspires with its new user interface and increased process flexibility.
● Flexible system configuration on account of modularity of the design
● Product change without loss in production time with the multi-wave process (in preparation)
1. Roller-type conveyor for direct board handling.
2. The flux spraying nozzle can use the U-SONIC Ultrasonic Atomization nozzle.
3. The solder pot can be added flexible.
4. Preheating module has upper and bottom preheat mode,customers can choice the option according to the products.
5. The solder module up to more than 3 solder bath.
6. Transfer of board data from the CAD system.