Reflow Soldering with Air 6 Zones

Reflow Soldering with Air 6 Zones

Reflow Soldering with air 6 zones HB Automation Advantages HB Automation is a comprehensive supplier in the SMT market to provide our customer with a wide range of the most innovative and reliable types of SMT equipment including Reflow oven. • with 6 zones model, with thermal accuracy of ±1˚C,...

Product Details

Reflow Soldering with air 6 zones

Reflow Soldering with air 6 zones(002).jpg


HB Automation Advantages
HB Automation is a comprehensive supplier in the SMT market to provide our customer with a wide range of the most innovative and reliable types of SMT equipment including Reflow oven.
• with 6 zones model, with thermal accuracy of ±1˚C,
• produces a ΔT of ±2°C across.
• blowers and solder pot - 2 on all other parts.
• Best in the industry warranty – 5 years for the heaters, 
• More standard features than any other oven available in the market


Specification:

Model

HS-0601

Dimension(L*W*H)mm

3600*1383*1490mm

Weight (kg)

1325kg

Number of heating zones

Top 6+ bottom 6

Length of heating zones

2359mm

Number of cooling zones

Top 1 Forced air cooling

Nozzle plate

8 mm Aluminum alloy plates

Exhaust volume

10M2/min *2 channel exhaust

Control system


Power supply requirements

3 phase,380V 50/60Hz (optional: 3 phase,220V 50/60V)

Total Power

52KW

Startup power

26KW

Normal Power consumption

7KW

Warming time

< 15mins

Temp. setting range

Room temperature to300°C

Temperature control method

PID Close loop control +SSR Driving

Temperature control precision

+/- 1.0 °C

Temperature deviation on PCB

+/- 1.5°C ( by HB test standard )

Conveyor system


Chain structure

Single buckle

Max. PCB width

400mm

Range of rail width

50-400mm

Components clearance

Top/Bottom clearance of PCB: 25mm

Conveyor direction

L to R ( Optional R to L )

PCB transmission method

Chain + Mesh

Conveyor speech

300mm /min-2000mm / min

lubrication

Auto-lubrication + Manual-lubrication

Optional

Full N2 system, Center support system ,KIC RPI reflow process inspection ,Dual lane


Main Features
• 6 zones model HS-0601
• Combination pin chain and mesh belt conveyors
• Flux collection system
• Windows 7. Operator interface
• 5 years for the heaters, blowers and solder pot - 2 on all other parts.
• UPS power supply equipped
• Center support, auto width control, Nitrogen system provided (optional)


Details

  


The cooling configuration recycles the filtered air or N2 back to the oven chamber reducing thermal loss while getting better flux reclamation.
• Two powerful fans force recirculated cooled air into the cooling zone
• Total cooling length:900mm
• Filtration system is easily accessible for quick maintenance and Easy access to cooling panels for quick maintenance.


Certificate:

Quality certificate(001).jpg


FQA:
Q: Can you make the customized product according to different application?

A: Yes, we can. Our engineers have a lot experience in design customized products for Flextronics, Continental, HUAWEI.

Q: Things to Know
A: When dealing with reflow soldering there are some things to know which usually are not needed when hand soldering with an iron.


Moisture Content
If you have a lot of components to be soldered in many PCBs during more than one day, always use an ESD safe sealed bag and keep them in it, with the indicator and the desiccant. If you have some sensible components sitting in a box for more than a few days you should try to let the moisture in it evaporate gently before attempting any reflow.
HB comes with a preprogrammed desiccant profile to keep the components at 125°C for 60/90 minutes.
Even so keep in mind that this is not an ideal process and that micro fractures could be forming.


Inquiry