Hot Air SMT Reflow Oven

Hot Air SMT Reflow Oven

Hot air SMT Reflow Oven 8 zones The HB Automation's Advantage • HB Automation has a long tradition of providing quality equipment and service • Best in the industry warranty – 5 years for the heaters, blowers and solder pot - 2 on all other parts • Lifetime free software upgrades • Lifetime...

Product Details

Hot air SMT Reflow Oven 8 zones

SMT reflow oven 8 zones(001).jpg


The HB Automation's Advantage
• HB Automation has a long tradition of providing quality equipment and service
• Best in the industry warranty – 5 years for the heaters, blowers and solder pot - 2 on all other parts
• Lifetime free software upgrades
• Lifetime free training at any HB factory
• More standard features than any other oven available in the market


Main Features
• 8 zones model HS-0802
• Motorized width adjust (Optional: PC control width adjustment)
• Flux collection system (Standard)
• Smema communication
• Light tower
• Uninterruptible power supply
• 300ºC high temperature processing capabilities
• Comprehensive warranty
• Full nitrogen system (Optional)


Specification:

Model

HS-0802

Dimension(L*W*H)mm

5310*1353*1490mm

Weight (kg)

2200kg

Number of heating zones

Top 8+ bottom 8

Length of heating zones(mm)

3121mm

Number of cooling zones

Top 2 Forced air cooling

Nozzle plate

8 mm Aluminum alloy plates

Exhaust volume

10M2/min *2 channel exhaust

Control system


Power supply requirements

3 phase,380V 50/60Hz ( optional: 3 phase,220V 50/60V)

Total Power

64KW

Startup power

28KW

Normal Power consumption

9KW

Warming time

30 minutes

Temp. setting range

Room temperature to 300°C

Temperature control method

PID Close loop control +SSR Driving

Temperature control precision

+/- 1.0 °C

Temperature deviation on PCB

+/- 1.5°C ( by HB test standard )

Conveyor system


Chain structure

Single buckle for preventing board jammed

Max. PCB width

400mm ( Optional 610mm )

Range of rail width

50mm -400mm (optional 50mm -610mm )

Components clearance

Top/Bottom clearance of PCB : 25mm

Conveyor direction

L to R ( Optional R to L )

PCB transmission method

Chain + Mesh

Conveyor speech

300mm /min-2000mm / min

lubrication

Auto-lubrication + Manual-lubrication

Optional

Full N2 system, Center support system, KIC RPI reflow process inspection, Dual lane


  


Closed loop nitrogen control system (Option)
To maintain stable, user-selected oxygen PPM levels automatically. A wide range of PPM levels can be selected with nitrogen consumption rate as low as depending upon board size. An internal oxygen sensor and proportioning valve is used to minimize nitrogen consumption and related costs by up to 50% ! Use completely sealed design inside the chamber of oven to be effective protection for nitrogen, the nitrogen content of the minimum can be as low as 150 ppm. Under the circumstances of 300-800ppm oxygen, the consumption of nitrogen is lower than 18 m3/H.


Qualification

Quality certificate(001).jpg


FQA
Q: What is your main advantage?

A: Quality is our advantage We have a long history in design and manufacturing of reflow system, wave soldering system,selective soldering system and bring the innovation of vertical curing system. Most of our end users are the multinational company like HUAWEI,FLEX,GE,LG,Continental Automotive, BYD, TDK.

Q: Hot and Cold Spot
A: It may be quite difficult, even with big professional ovens, to keep a uniform temperature across the entire PCB.
When using a toaster oven this problem can cause some serious issues like pads where the solder paste do not reflow correctly or, even worst, components which overshoots the target temperature.
Moreover, since in the toaster ovens the heat is transferred mostly by radiation, remember that bigger black components heats faster than smaller ones. Ideally you should measure temperature over the entire board and across every component to be sure to have a profile with a peak temperature high enough for reflowing but not too high to cause thermal shock on the bigger components.


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