8 zones Lead Free Reflow Oven
HB Automation Advantages
HB Automation is a comprehensive supplier in the SMT market to provide our customer with a wide range of the most innovative and reliable types of SMT equipment including Reflow oven with 6,8,10,12 zones model, with thermal accuracy of ±1˚C, produces a ΔT of ±2°C across. We have made one of our customers' main production challenges as our own: guaranteeing the highest productivity at the lowest manufacturing cost.
Number of heating zones
Top 8+ bottom 8
Length of heating zones(mm)
Number of cooling zones
Top 2 Forced air cooling
10M2/min *2 channel exhaust
Power supply requirements
3 phase, 380V 50/60Hz ( optional: 3 phase, 220V 50/60V)
Normal Power consumption
Temp. setting range
Room temperature to 300°C
Temperature control method
PID Close loop control +SSR Driving
Temperature control precision
+/- 1.0 °C
Temperature deviation on PCB
+/- 1.5°C ( by HB test standard )
Single buckle for preventing board jammed
Max. PCB width
400mm ( Optional 610mm )
Range of rail width
50mm -400mm (optional 50mm -610mm )
Top/Bottom clearance of PCB: 25mm
L to R ( Optional R to L )
PCB transmission method
Chain + Mesh
300mm /min-2000mm / min
Auto-lubrication + Manual-lubrication
• 8 zones model CS-0802
• Combination pin chain and mesh belt conveyors
• Motorized width adjust (optional: PC control width adjustment)
• Flux collection system
Independent air velocity controlling system allows flexible processing control to easily handle complicated lead free soldering requirements. The CS-0802 has 2 ramp-up zones, 4 soaking zones, 2 reflow zones, and 2 cooling zones.
Q: What is your normal lead time?
A: For standard machine, our lead time is 3 weeks. Customized product may be a little longer.
Q: Why Reflow?
A: Because it is easy, fast, reliable and gives professional results with very little skills to master.
While many SMD components can be soldered with just a standard iron this is generally a very slow process. It also requires some skills to be able to solder smaller components and high-density pins.
Some footprints like QFN are very difficult to be soldered with an iron even for a trained technician and often those joints are not good enough even for prototyping purposes. BGA components are of course impossible to deal with and for them a reflow oven is a must.
Reflow ovens are the first choice in the industry for production and prototyping, the only downside are their cost and the costs related to reflow technique: you are going to need a stencil for every board and you need to use solder paste which is generally quite expansive.
Lately these costs, thanks to some Chinese production facilities and resellers have been lowered from several hundreds of dollars for a steal stencil to less than 20 USD, allowing even hobbyists to build devices with modern and difficult footprints.
The only high cost device to buy is a reflow oven.