Semiconductor curing oven
Increase productivity, improve quality, reduce costs ----- HB Vertical curing oven
Design for customers'requirement! Design for quality and less cost!
Customized curing ovens for your products!
With the largest installed base of China-made in-line vertical curing oven in China, HB is the preferred choice of many leading electronics manufacturers. Just as we pioneered SMT solder reflow advances... including high quality convection and economical nitrogen usage... we are now the second to offer a family of customized ovens for a variety of curing needs in the world. As a market leader, HB has the versatility, flexibility and engineering capabilities to develop custom solutions for your individual curing requirements.Our clients are all over the world,such as HUAWEI,SUNMSUNG,LG,BYD,SKYWORTH,CASIO,VIVO,EMERSON,TOSHIBA and so on.
HB's global customer base knows it can depend on our reliable equipment... continuous innovation... and responsive engineering. We provide a global service network, supported by a 24-hour beeper number. This state-of-the-art system enables our service engineers to access your oven's internal electronics and answer your questions, wherever you are, whenever you have a concern.
1. Save the plant space.
HB's vertical curing oven adopts vertical design which make full use of the height space.
2. Save energy consumption.
No manual operating to put in and take out of the PCB,which can save many energy consumption.
3. The curing temperature is more uniformity.
Adopts the hot air reflow heating modes, the supply of heating offer quickly.
4. Save manpower evidently.
The PCB is conveyed automatically inlet and output function.
5. It is safer the other regular oven.
Because HB curing oven is all inline and automatically, there is no need to take out the PCB which may be scalded by the hot oven.
6. Improve the products quality.
1. HB is the first enterprise to design and manufacture the vertical curing oven in China.
2. HB has very strong research capability, the process of the curing oven.
3. HB are courageous to challenge and innovate.
4. HB has many customers in mobile phone, battery,....
5. HB is very experience in vertical curing oven. From the first generation to the seventh generation product, we solve more 800 problem.
6. We accumulate a lot of data, such as the moving speed, the strength of the pushing PCB and moving time and so on.
Q:What are the process control conditions of the wave soldering machine?
A:1.The proportion of flux
4.The distance between spraying nozzle and PCB board
5.The humidity of the tin
6.Temperature of tin
Q:What are the differences between wave soldering and manual soldering?
A:The essence differences between wave soldering and manual soldering is preheating zone.The impurities in flux on PCB board volatilize more efficiency and improve the soldering quality in wave soldering, besides, the wave soldering is more efficient than manual soldering.